Microstructure evolution and thermomechanical fatigue of solder materials
type: CreativeWork
type: ProductModel
type: Book
issued: 2005
about: p075622203
about: p075615223
about: p075664364
author: p29758734X
author: p075382903
description: Proefschrift Technische Universiteit Eindhoven
language: en
isbn: 9038628870
main entity of page: https://data.bibliotheken.nl/.well-known/genid/71ad282592a3a9c27540aea8f85a6d46
number of pages: 98
label: Microstructure evolution and thermomechanical fatigue of solder materials / Md. Abdul Matin